#1
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Hfs-3.1 soldering
Hi everyone,
I've been looking at the version 3.12 instructions about soldering the mps pad onto the idc pad to allow for 30% boost correction for flow, but I have the earlier model red v3.1 circuit board, S/N 102859. Are these instructions still applicable for this board? Once soldered, do you then need to use a spare jumper to have both the idc and mps settings selected, or is just one fine as they're tied together? I was looking for advice on the initial setup also. The car is a Mitsubishi, running a 4g63t motor with 9.6:1 comp, turbo is equivalent to a gtx3576r, running over 25pai. The plan was to run 4x0.5mm direct port nozzles, with a 0.5mm pre throttle body and a 0.8-1.0mm nozzle in the turbo volute to try and boost the turbos efficiency. I have 1000cc fuel injectors and the plan was to start wmi at 20% idc as that's around 1 bar of boost. Should I move the pre-scaler or will I have enough adjustment where it sits? Currently the car is only hitting 70% idc max. |
#2
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Re: Hfs-3.1 soldering
This 30% MPS option is still valid to date.
HFS3v3.1 allows you to scale up the incoming idc signal. Try x1.25
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Richard L aquamist technical support |
Tags |
mitsubishi, setup, solder |
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